電信電路,其他電信集成電路 - 參數搜索 - datasheet5電子元器件查詢網

								Most Relevant					Technical				Compliance			Operating Conditions						Physical											Dimensions			Other
對比	制造商型號	制造商	綜合價格	風險等級	是否無鉛	是否Rohs認證	生命周期	標稱供電電壓	技術	收發器數量	數據速率	電信集成電路類型	功能數量	電源	最大壓擺率	溫度等級	JESD-30 代碼	JESD-609代碼	認證狀態	濕度敏感等級	最高工作溫度	最低工作溫度	峰值回流溫度（攝氏度）	篩選級別	處于峰值回流溫度下的最長時間	端子數量	封裝主體材料	封裝代碼	封裝等效代碼	封裝形狀	封裝形式	表面貼裝	端子面層	端子形式	端子節距	端子位置	寬度	長度	座面最大高度	Source Content uid	Modified On	是否符合REACH標準	ECCN代碼	HTS代碼	交付時間	Date Of Intro	包裝說明	零件包裝代碼	針數	Country Of Origin	YTEOL	制造商包裝代碼
對比	RN4871-V/RM118	Microchip Technology Inc	查詢價格				Active	3 V			10 Mbps	TELECOM CIRCUIT	1			COMMERCIAL	R-XXMA-N16				70 °C	-20 °C		TS 16949		16	UNSPECIFIED	XMA	MODULE,16LEAD(UNSPEC)	RECTANGULAR	MICROELECTRONIC ASSEMBLY	YES		NO LEAD	1.2 mm	UNSPECIFIED	9 mm	11.5 mm	2.16 mm	RN4871-V/RM118	2022-08-02 17:41:45	compliant	5A992.C	8529.90.22.00	[object Object]	2016-04-26
對比	RN4871-I/RM128	Microchip Technology Inc	查詢價格				Active	3.3 V			10 Mbps	TELECOM CIRCUIT	1			INDUSTRIAL	R-XXMA-N16				85 °C	-40 °C		TS 16949		16	UNSPECIFIED	XMA	MODULE,16LEAD(UNSPEC)	RECTANGULAR	MICROELECTRONIC ASSEMBLY	NO		NO LEAD	1.2 mm	UNSPECIFIED	9 mm	11.5 mm	2.16 mm		2022-09-01 22:18:00	compliant	5A992.C	8529.90.22.00	[object Object]		MODULE-16
對比	ATA8403C-6AQY-66	Microchip Technology Inc	查詢價格				Active	3 V				TELECOM CIRCUIT	1			OTHER	S-PDSO-G8	e3			85 °C	-55 °C	NOT SPECIFIED		NOT SPECIFIED	8	PLASTIC/EPOXY	TSSOP	TSSOP8,.19	SQUARE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	Matte Tin (Sn)	GULL WING	650 µm	DUAL	3 mm	3 mm	1.05 mm	ATA8403C-6AQY-66	2022-10-03 19:18:48	compliant		8542.39.00.01	[object Object]		TSSOP-8
對比	RN4678-V/RM100	Microchip Technology Inc	查詢價格				Active	3.3 V				TELECOM CIRCUIT	1			COMMERCIAL	R-XXMA-N33				70 °C	-20 °C				33	UNSPECIFIED	XMA		RECTANGULAR	MICROELECTRONIC ASSEMBLY	YES		NO LEAD	1.1 mm	UNSPECIFIED	12 mm	22 mm	2.46 mm	RN4678-V/RM100	2022-10-03 19:16:42	compliant	5A992.C	8529.90.22.00			MODULE-33
對比	RN4870-V/RM118	Microchip Technology Inc	查詢價格				Active	3.3 V			10 Mbps	TELECOM CIRCUIT	1			COMMERCIAL	R-XXMA-N33				70 °C	-20 °C				33	UNSPECIFIED	XMA	MODULE,33LEAD(UNSPEC)	RECTANGULAR	MICROELECTRONIC ASSEMBLY	NO		NO LEAD	1.1 mm	UNSPECIFIED	12 mm	22 mm	2.46 mm	RN4870-V/RM118	2022-08-02 14:57:52	compliant	5A992.C	8529.90.22.00	[object Object]	2016-04-26	MODULE-33
對比	RN4871U-V/RM118	Microchip Technology Inc	查詢價格				Active	3 V			10 Mbps	TELECOM CIRCUIT	1				R-XXMA-N16				70 °C	-20 °C		TS 16949		16	UNSPECIFIED	XMA		RECTANGULAR	MICROELECTRONIC ASSEMBLY	YES		NO LEAD		UNSPECIFIED	9 mm	11.5 mm	2.1 mm	RN4871U-V/RM118	2022-08-02 13:13:15	compliant	5A992.C	8529.90.22.00		2016-04-26
對比	TLK1501IRCP	Texas Instruments	查詢價格		Yes	Yes	Active	2.5 V	TTL		2.5 Tbps	TELECOM CIRCUIT	1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		30	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK1501IRCP	2023-01-29 00:01:02	compliant	5A991.B.1	8542.39.00.01			HVFQFP, TQFP64,.47SQ	QFP	64	Taiwan	15
對比	TLK1501IRCPR	Texas Instruments	查詢價格		Yes	Yes	Active	2.5 V	TTL		2.5 Tbps	TELECOM CIRCUIT	1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		30	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK1501IRCPR	2023-01-29 00:01:02	compliant	5A991.B.1	8542.39.00.01			HVFQFP, TQFP64,.47SQ	QFP	64	Taiwan	15
對比	TUSB212IRWBT	Texas Instruments	查詢價格		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT	1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	85 °C	-40 °C	260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB212IRWBT	2023-01-29 00:01:02	compliant	EAR99	8542.39.00.01		2017-09-06	VQCCN,				15
對比	TUSB212QRWBRQ1	Texas Instruments	查詢價格		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT	1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	105 °C	-40 °C	260	AEC-Q100	30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB212QRWBRQ1	2023-01-29 00:01:02	compliant	EAR99			2017-09-09	VQCCN,				15
對比	TUSB214RWBR	Texas Instruments	查詢價格		Yes	Yes	Active	3.3 V			4 Gbps	TELECOM CIRCUIT	1		30 µA	COMMERCIAL	S-PQCC-N12	e4		2	70 °C		260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB214RWBR	2023-01-29 00:01:02	compliant	EAR99			2017-09-12	VQCCN,				15
對比	HTRC11001T/02EE,11	NXP Semiconductors	查詢價格			Yes	Active	5 V				TELECOM CIRCUIT	1	5 V	10 µA	INDUSTRIAL	R-PDSO-G14	e4	Not Qualified	1	85 °C	-40 °C	260		30	14	PLASTIC/EPOXY	SOP	SOP14,.25	RECTANGULAR	SMALL OUTLINE	YES	NICKEL PALLADIUM GOLD	GULL WING	1.27 mm	DUAL	4 mm	8.75 mm		HTRC11001T/02EE,11	2022-12-05 19:58:16	compliant		8542.39.00.01			SOP, SOP14,.25	SOIC	14			SOT108-1
對比	TLK2501IRCPR	Texas Instruments	查詢價格		Yes	Yes	Active	2.5 V		1	2.5 Tbps	TELECOM CIRCUIT	1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		30	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK2501IRCPR	2023-01-29 00:01:02	compliant	5A991.B.1	8542.39.00.01			HVFQFP, TQFP64,.47SQ	QFP	64	Taiwan	15
對比	BLUENRG-345VC	STMicroelectronics	查詢價格				Active	1.8 V			2 Gbps	TELECOM CIRCUIT	1				S-XBGA-B49				85 °C	-40 °C				49	UNSPECIFIED	BGA		SQUARE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES		BALL	400 µm	BOTTOM	3.14 mm	3.14 mm	420 µm	BLUENRG-345VC	2023-01-24 04:03:42	compliant	5A992.C	8542.39.00.01	[object Object]	2020-07-16				Taiwan	9.17
對比	TUSB214QRWBRQ1	Texas Instruments	查詢價格		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT	1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	105 °C	-40 °C	260	AEC-Q100	30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB214QRWBRQ1	2023-01-29 00:01:02	compliant	EAR99			2017-08-25	VQCCN,				15
對比	TUSB214IRWBR	Texas Instruments	查詢價格		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT	1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	85 °C	-40 °C	260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB214IRWBR	2023-01-29 00:01:02	compliant	EAR99			2017-09-12	VQCCN,				15
對比	TUSB212IRWBR	Texas Instruments	查詢價格		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT	1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	85 °C	-40 °C	260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB212IRWBR	2023-01-29 00:01:02	compliant	EAR99			2017-09-06	VQCCN,				15
對比	TLK2501IRCP	Texas Instruments	查詢價格		Yes	Yes	Active	2.5 V		1	2.5 Tbps	TELECOM CIRCUIT	1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		30	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK2501IRCP	2023-01-29 00:01:02	compliant	5A991.B.1	8542.39.00.01			HVFQFP, TQFP64,.47SQ	QFP	64	Taiwan	15
對比	TUSB212RWBR	Texas Instruments	查詢價格		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT	1		30 µA	COMMERCIAL	S-PQCC-N12	e4		2	70 °C		260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB212RWBR	2023-01-29 00:01:02	compliant	EAR99			2017-09-13	VQCCN,				15
對比	MRF24J40ME-I/RM	Microchip Technology Inc	查詢價格		Yes		Active	3.3 V				TELECOM CIRCUIT	1			INDUSTRIAL	R-XDMA-N12				85 °C	-40 °C		TS 16949		12	UNSPECIFIED			RECTANGULAR	MICROELECTRONIC ASSEMBLY	NO		NO LEAD	2.54 mm	DUAL	22.86 mm	33.02 mm	3.48 mm	MRF24J40ME-I/RM	2023-01-03 22:58:52	compliant	5A992.C	8529.90.22.00			MODULE-12

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