Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
對比 | 制造商型號 | 制造商 | 綜合價格 | 風險等級 | 是否無鉛 | 是否Rohs認證 | 生命周期 | 標稱供電電壓 | 技術 | 數據速率 | 其他特性 | 功能數量 | 電源 | 最大壓擺率 | 溫度等級 | 電信集成電路類型 | JESD-30 代碼 | JESD-609代碼 | 認證狀態 | 濕度敏感等級 | 最高工作溫度 | 最低工作溫度 | 峰值回流溫度(攝氏度) | 處于峰值回流溫度下的最長時間 | 端子數量 | 封裝主體材料 | 封裝代碼 | 封裝等效代碼 | 封裝形狀 | 封裝形式 | 表面貼裝 | 端子面層 | 端子形式 | 端子節距 | 端子位置 | 寬度 | 長度 | 座面最大高度 | Source Content uid | Modified On | 零件包裝代碼 | 包裝說明 | 針數 | 制造商包裝代碼 | 是否符合REACH標準 | HTS代碼 | 交付時間 | ECCN代碼 | Country Of Origin | YTEOL | Date Of Intro | 特征 | |
對比 | A5191HRTLG-XTP | onsemi | 查詢價格 | Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQFP-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | A5191HRTLG-XTP | 2022-10-03 14:29:53 | QFP | 7.00 X 7.00 MM, GREEN, LQFP-32 | 32 | 561AB | compliant | 8542.39.00.01 | [object Object] | |||||||||
對比 | MPL360BT-I/Y8X | Microchip Technology Inc | 查詢價格 | Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-PQFP-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.2 mm | MPL360BT-I/Y8X | 2022-08-02 12:56:23 | TQFP-48 | compliant | 8542.31.00.01 | [object Object] | 5A992.C | ||||||||||||||||||||||
對比 | A5191HRTPG-XTP | onsemi | 查詢價格 | Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | A5191HRTPG-XTP | 2022-10-03 14:29:53 | QLCC | GREEN, PLASTIC, LCC-28 | 28 | 776AA | compliant | 8542.39.00.01 | [object Object] | |||||||||
對比 | ST7540 | STMicroelectronics | 查詢價格 | Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | ST7540 | 2023-02-07 04:03:00 | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | 8542.39.00.01 | [object Object] | EAR99 | |||||||||||
對比 | MPL360BT-I/SCB | Microchip Technology Inc | 查詢價格 | Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-XQCC-N48 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | LCC48,.25SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | 900 µm | MPL360BT-I/SCB | 2022-08-02 18:01:58 | QFN-48 | compliant | 8542.39.00.01 | [object Object] | 5A992.C | ||||||||||||||||||||||
對比 | ST7540TR | STMicroelectronics | 查詢價格 | Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | ST7540TR | 2023-02-07 04:03:00 | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | 8542.39.00.01 | [object Object] | EAR99 | |||||||||||
對比 | A5191HRTLG-XTD | onsemi | 查詢價格 | Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQFP-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | A5191HRTLG-XTD | 2022-10-03 14:29:53 | QFP | 7.00 X 7.00 MM, GREEN, LQFP-32 | 32 | 561AB | compliant | 8542.39.00.01 | [object Object] | |||||||||
對比 | TDA5051AT/C1,518 | NXP Semiconductors | 查詢價格 | Yes | Active | 5 V | CMOS | 5 V | 68 µA | COMMERCIAL | MODEM | R-PDSO-G16 | Not Qualified | 3 | 70 °C | 260 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | TDA5051AT/C1,518 | 2023-03-10 17:52:19 | SOP | SOP, SOP16,.4 | 16 | SOT162-1 | compliant | 8542.39.00.01 | [object Object] | EAR99 | |||||||||||||||||
對比 | LTC5585IUF#PBF | Analog Devices Inc | 查詢價格 | No | Yes | Active | 5 V | CMOS | 1 | INDUSTRIAL | MODEM-DEMODULATOR | S-PQCC-N24 | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | LTC5585IUF#PBF | 2023-03-10 18:02:38 | HVQCCN, | 24 | 05-08-1697 | compliant | Malaysia | 8.5 | ||||||||||||||
對比 | MPL360B-I/Y8X | Microchip Technology Inc | 查詢價格 | Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-PQFP-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.2 mm | MPL360B-I/Y8X | 2022-08-02 15:50:36 | TQFP-48 | compliant | 8542.39.00.01 | [object Object] | 5A992.C | ||||||||||||||||||||||
對比 | MPL360B-I/SCB | Microchip Technology Inc | 查詢價格 | Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-XQCC-N48 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | LCC48,.25SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | 900 µm | MPL360B-I/SCB | 2022-08-02 15:50:44 | QFN-48 | compliant | 8542.39.00.01 | [object Object] | 5A992.C | ||||||||||||||||||||||
對比 | A5191HRTPG-XTD | onsemi | 查詢價格 | Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | A5191HRTPG-XTD | 2022-10-03 14:29:53 | QLCC | QCCJ, LDCC28,.5SQ | 28 | 776AA | compliant | 8542.39.00.01 | [object Object] | |||||||||
對比 | DS8500-JND+ | Maxim Integrated Products | 查詢價格 | Yes | Yes | Transferred | 1.2 Mbps | 1 | 3/3.3 V | 285 nA | INDUSTRIAL | MODEM | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.20SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | 2023-02-04 21:02:16 | QFN | HVQCCN, LCC20,.20SQ,25 | 20 | compliant | 8542.39.00.01 | EAR99 | Japan, Mainland China, Malaysia, Philipp... more | 9 | ||||||||||
對比 | DAC8742HPBSR | Texas Instruments | 查詢價格 | Yes | Yes | Active | 31.25 Mbps | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQFP-G32 | e4 | 3 | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | PLASTIC/EPOXY | TFQFP | TQFP32,.28SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 5 mm | 5 mm | 1.2 mm | DAC8742HPBSR | 2023-03-26 00:01:00 | TFQFP, TQFP32,.28SQ | compliant | 8542.39.00.01 | EAR99 | Taiwan | 15 | 2017-12-16 | |||||||||||||
對比 | CPC5621ATR | IXYS Integrated Circuits Division | 查詢價格 | Yes | Yes | Transferred | 3.3 V | IT CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY | 1 | 3.3/5 V | 10 µA | INDUSTRIAL | MODEM-SUPPORT CIRCUIT | R-PDSO-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | SSOP | SSOP32,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 635 µm | DUAL | 7.493 mm | 10.287 mm | 2.134 mm | 2023-01-04 01:31:28 | SOIC | SSOP, SSOP32,.4 | 32 | unknown | 8542.39.00.01 | Modem-Support Circuit | |||||||||||||
對比 | DAC8741HRGET | Texas Instruments | 查詢價格 | Yes | Yes | Active | 31.25 Mbps | DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQCC-N24 | e4 | 2 | 125 °C | -55 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | DAC8741HRGET | 2023-03-26 00:01:00 | HVQCCN, | compliant | 8542.39.00.01 | EAR99 | 15 | |||||||||||||||
對比 | DAC8740HRGET | Texas Instruments | 查詢價格 | Yes | Yes | Active | 31.25 Mbps | DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQCC-N24 | e4 | 2 | 125 °C | -55 °C | 260 | NOT SPECIFIED | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.15SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | DAC8740HRGET | 2023-03-26 00:01:00 | HVQCCN, LCC24,.15SQ,20 | compliant | 15 | 2017-12-16 | |||||||||||||||
對比 | ST7538QTR | STMicroelectronics | 查詢價格 | Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | S-PQFP-G44 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | NICKEL PALLADIUM GOLD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.6 mm | ST7538QTR | 2023-02-07 04:03:00 | QFP | LQFP, QFP44,.47SQ,32 | 44 | compliant | 8542.39.00.01 | [object Object] | EAR99 | |||||||||||
對比 | ST7538Q | STMicroelectronics | 查詢價格 | Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | S-PQFP-G44 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | NICKEL PALLADIUM GOLD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.6 mm | ST7538Q | 2023-02-07 04:03:00 | QFP | LQFP, QFP44,.47SQ,32 | 44 | compliant | 8542.39.00.01 | [object Object] | EAR99 | |||||||||||
對比 | XK3-C-A1-UT-U | Digi International Inc | 查詢價格 | Active | 2022-10-04 03:17:04 | compliant | [object Object] | 2020-04-01 |