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對比 | 制造商型號 | 制造商 | 綜合價格 | 風險等級 | 是否無鉛 | 是否Rohs認證 | 生命周期 | 標稱供電電壓 | 傳播延遲 | 輸入次數 | 輸出次數 | 專用輸入次數 | 宏單元數 | I/O 線路數量 | 可編程邏輯類型 | 篩選級別 | 溫度等級 | 封裝形狀 | 技術 | 組織 | 其他特性 | 架構 | 最大時鐘頻率 | 系統內可編程 | JTAG BST | 產品條款數 | 輸出函數 | 電源 | 最大供電電壓 | 最小供電電壓 | JESD-30 代碼 | 認證狀態 | JESD-609代碼 | 濕度敏感等級 | 最高工作溫度 | 最低工作溫度 | 峰值回流溫度(攝氏度) | 處于峰值回流溫度下的最長時間 | 端子數量 | 封裝主體材料 | 封裝代碼 | 封裝等效代碼 | 封裝形狀 | 封裝形式 | 包裝方法 | 表面貼裝 | 端子面層 | 端子形式 | 端子節距 | 端子位置 | 寬度 | 長度 | 座面最大高度 | Modified On | 包裝說明 | 是否符合REACH標準 | Country Of Origin | ECCN代碼 | HTS代碼 | YTEOL | 零件包裝代碼 | 針數 | 交付時間 | Source Content uid | |
對比 | EPM570F256C5N | Intel Corporation | 查詢價格 | Yes | Active | 2.5 V | 8.7 ns | 160 | 160 | 440 | 160 | FLASH PLD | OTHER | SQUARE | CMOS | 0 DEDICATED INPUTS, 160 I/O | IT CAN ALSO OPERATE AT 3.3V | YES | YES | MACROCELL | 1.5/3.3,2.5/3.3 V | 2.625 V | 2.375 V | S-PBGA-B256 | Not Qualified | e1 | 3 | 85 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 2.2 mm | 2022-08-02 17:40:49 | 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | compliant | Malaysia, South Korea | EAR99 | 8542.39.00.01 | 5.5 | ||||||||||||||||
對比 | XCR3064XL-10VQG44C | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 3.3 V | 10 ns | 64 | 36 | EE PLD | COMMERCIAL | SQUARE | CMOS | 0 DEDICATED INPUTS, 36 I/O | YES | 95 MHz | YES | YES | MACROCELL | 3.3 V | 3.6 V | 3 V | S-PQFP-G44 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 44 | PLASTIC/EPOXY | TQFP | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.2 mm | 2022-09-02 03:12:46 | LEAD FREE, VQFP-44 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFP | 44 | [object Object] | |||||||||||
對比 | XCR3032XL-10VQG44C | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 3.3 V | 10 ns | 32 | 36 | EE PLD | COMMERCIAL | SQUARE | CMOS | 0 DEDICATED INPUTS, 36 I/O | YES | 95 MHz | YES | YES | MACROCELL | 3.3 V | 3.6 V | 3 V | S-PQFP-G44 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 44 | PLASTIC/EPOXY | TQFP | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.2 mm | 2022-08-02 16:36:41 | LEAD FREE, VQFP-44 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFP | 44 | [object Object] | |||||||||||
對比 | XCR3064XL-10VQG44I | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 3.3 V | 10 ns | 64 | 36 | EE PLD | INDUSTRIAL | SQUARE | CMOS | 0 DEDICATED INPUTS, 36 I/O | YES | 95 MHz | YES | YES | MACROCELL | 3/3.3 V | 3.6 V | 2.7 V | S-PQFP-G44 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | TQFP | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.2 mm | 2022-09-02 03:05:45 | LEAD FREE, VQFP-44 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFP | 44 | [object Object] | ||||||||||
對比 | XCR3128XL-10VQG100C | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 3.3 V | 10 ns | 128 | 84 | EE PLD | COMMERCIAL | SQUARE | CMOS | 0 DEDICATED INPUTS, 84 I/O | YES | 95 MHz | YES | YES | MACROCELL | 3.3 V | 3.6 V | 3 V | S-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | TFQFP | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.2 mm | 2022-08-02 16:58:21 | LEAD FREE, VQFP-100 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFP | 100 | [object Object] | |||||||||||
對比 | XCR3128XL-10VQG100I | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 3.3 V | 10 ns | 128 | 84 | EE PLD | INDUSTRIAL | SQUARE | CMOS | 0 DEDICATED INPUTS, 84 I/O | YES | 95 MHz | YES | YES | MACROCELL | 3/3.3 V | 3.6 V | 2.7 V | S-PQFP-G100 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | TFQFP | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.2 mm | 2022-08-02 14:42:17 | LEAD FREE, VQFP-100 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFP | 100 | [object Object] | ||||||||||
對比 | XC95288XL-10TQG144I | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 3.3 V | 10 ns | 117 | 117 | 288 | 117 | FLASH PLD | INDUSTRIAL | SQUARE | CMOS | 0 DEDICATED INPUTS, 117 I/O | YES | 100 MHz | YES | YES | MACROCELL | 2.5/3.3,3.3 V | 3.6 V | 3 V | S-PQFP-G144 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 144 | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | 2022-08-02 16:21:17 | LEAD FREE, TQFP-144 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFP | 144 | [object Object] | ||||||||
對比 | XC95288XL-10TQG144C | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 3.3 V | 10 ns | 117 | 117 | 288 | 117 | FLASH PLD | COMMERCIAL | SQUARE | CMOS | 0 DEDICATED INPUTS, 117 I/O | YES | 100 MHz | YES | YES | MACROCELL | 2.5/3.3,3.3 V | 3.6 V | 3 V | S-PQFP-G144 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 144 | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | 2022-08-02 14:28:08 | LEAD FREE, TQFP-144 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFP | 144 | [object Object] | |||||||||
對比 | JM38510/50403BRA | Texas Instruments | 查詢價格 | No | Active | 5 V | 30 ns | OT PLD | MIL-M-38510 Class B | MILITARY | RECTANGULAR | TTL | 20 MHz | MIXED | R-GDIP-T20 | Not Qualified | e0 | 125 °C | -55 °C | 20 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | 2023-01-04 00:53:30 | DIP, | not_compliant | 3A001.A.2.C | 8542.39.00.01 | 15 | DIP | 20 | JM38510/50403BRA | ||||||||||||||||||||||||||||
對比 | PAL16R8AMJB | Texas Instruments | 查詢價格 | Yes | No | Active | 5 V | 25 ns | 8 | 8 | 8 | OT PLD | 38535Q/M;38534H;883B | MILITARY | RECTANGULAR | TTL | 8 DEDICATED INPUTS, 0 I/O | PAL-TYPE | 25 MHz | NO | NO | 64 | REGISTERED | 5 V | 5.5 V | 4.5 V | R-GDIP-T20 | Not Qualified | e0 | 125 °C | -55 °C | 20 | CERAMIC, GLASS-SEALED | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | TUBE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 24.195 mm | 5.08 mm | 2023-01-29 00:01:02 | DIP, DIP20,.3 | not_compliant | 3A001.A.2.C | 8542.39.00.01 | 15 | DIP | 20 | PAL16R8AMJB | ||||||||||
對比 | TIBPAL16R4-30MJB | Texas Instruments | 查詢價格 | Yes | No | Active | 5 V | 30 ns | 12 | 8 | 8 | 4 | OT PLD | MIL-STD-883 | MILITARY | RECTANGULAR | TTL | 8 DEDICATED INPUTS, 4 I/O | PAL-TYPE | 30 MHz | NO | NO | 64 | MIXED | 5 V | 5.25 V | 4.75 V | R-GDIP-T20 | Not Qualified | e0 | 125 °C | -55 °C | 20 | CERAMIC, GLASS-SEALED | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | TUBE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 24.195 mm | 5.08 mm | 2023-01-29 00:01:02 | DIP, DIP20,.3 | not_compliant | 3A001.A.2.C | 8542.31.00.01 | 15 | DIP | 20 | TIBPAL16R4-30MJB | |||||||||
對比 | XC2C32A-6VQG44I | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 1.8 V | 6 ns | 32 | 33 | FLASH PLD | INDUSTRIAL | SQUARE | CMOS | 33 I/O | REAL DIGITAL DESIGN TECHNOLOGY | 300 MHz | YES | YES | MACROCELL | 1.5/3.3,1.8 V | 1.9 V | 1.7 V | S-PQFP-G44 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | TQFP | LCC32,.2SQ,20 | SQUARE | FLATPACK, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.2 mm | 2022-08-02 13:04:22 | 10 X 10 MM, 0.80 MM PITCH, LEAD FREE, VQFP-44 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFP | 44 | [object Object] | ||||||||||
對比 | XC2C32A-6QFG32I | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 1.8 V | 6 ns | 32 | 21 | FLASH PLD | INDUSTRIAL | SQUARE | CMOS | 21 I/O | REAL DIGITAL DESIGN TECHNOLOGY | 300 MHz | YES | YES | MACROCELL | 1.5/3.3,1.8 V | 1.9 V | 1.7 V | S-PDSO-N32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | SON | LCC32,.2SQ,20 | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 5 mm | 5 mm | 1 mm | 2022-08-02 13:29:35 | 5 X 5 MM, 0.50 MM PITCH, LEAD FREE, QFN-32 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFN | 32 | [object Object] | ||||||||||
對比 | XC2C32A-6VQG44C | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 1.8 V | 6 ns | 32 | 33 | FLASH PLD | COMMERCIAL | SQUARE | CMOS | 33 I/O | REAL DIGITAL DESIGN TECHNOLOGY | 300 MHz | YES | YES | MACROCELL | 1.5/3.3,1.8 V | 1.9 V | 1.7 V | S-PQFP-G44 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 44 | PLASTIC/EPOXY | TQFP | LCC32,.2SQ,20 | SQUARE | FLATPACK, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.2 mm | 2022-08-02 13:29:35 | 10 X 10 MM, 0.80 MM PITCH, LEAD FREE, VQFP-44 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFP | 44 | [object Object] | |||||||||||
對比 | XC2C32A-6QFG32C | AMD Xilinx | 查詢價格 | Yes | Yes | Active | 1.8 V | 6 ns | 32 | 21 | FLASH PLD | COMMERCIAL | SQUARE | CMOS | 21 I/O | REAL DIGITAL DESIGN TECHNOLOGY | 300 MHz | YES | YES | MACROCELL | 1.5/3.3,1.8 V | 1.9 V | 1.7 V | S-PDSO-N32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | SON | LCC32,.2SQ,20 | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 5 mm | 5 mm | 1 mm | 2022-08-02 13:29:35 | 5 X 5 MM, 0.50 MM PITCH, LEAD FREE, QFN-32 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 4 | QFN | 32 | [object Object] | |||||||||||
對比 | ATF22V10CQ-15JU | Microchip Technology Inc | 查詢價格 | Yes | Yes | Active | 5 V | 15 ns | 22 | 10 | 10 | 10 | FLASH PLD | INDUSTRIAL | SQUARE | CMOS | 10 DEDICATED INPUTS, 10 I/O | PAL-TYPE | 55.5 MHz | NO | NO | 132 | MACROCELL | 5 V | 5.5 V | 4.5 V | S-PQCC-J28 | Not Qualified | e3 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | 2022-12-05 17:04:10 | GREEN, PLASTIC, MS-018AB, LCC-28 | compliant | Thailand | EAR99 | 8542.31.00.01 | 5 | [object Object] | ATF22V10CQ-15JU |